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Product>WAFER VACUUM COATING MACHINE
  • WAFER VACUUM COATING MACHINE
    The fully automatic wafer vacuum film sticking machine is applied to the automatic edge cutting and vacuum bonding of protective films for semiconductor silicon wafer etching and other processes. It is the first domestically developed and finalized equipment independently designed and manufactured by our company. After microscopic comparison verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment. By using a quick change stage, it is possible to quickly correspond to wafers of different sizes at 8 o’clock/12 o’clock.
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Contact : David Cao
M/WhatsApp: +86-135 1084 6501
Skype: info_433227
Email: david.cao@bright-ai.com
Address: No. 6 Baoye Road, Shangwei Village, Zhangkengjing Community, Guanhu Street, Longhua District, Shenzhen, China