- 3C
-
semiconductor
- Chip inverted film crystal expandingline
- AUTOMATIC WAFER TEARING MACHINE
- COMPRESSION MOLDING MACHINE
- AOI DETECTOR
- AUTOMATIC WAFER LAMINATING MACHINE
- WAFER VACUUM COATING MACHINE
- INTELLIGENT TRANSMISSION SYSTEM
- MINI/MICRO LED APPLICATION SCENARIOS
- MINI/MICRO LED - COB MODULE SOLUTION
- MINI/MICRO LED - MIP PACKAGING SOLUTION
- INTELLIGENT EQUIPMENT
-
Hydrogen Energy
- INTRODUCTION TO HYDROGEN ENERGY
- ELECTROLYZER SMART FACTORY (2.5GWH ELECTROLYZER INTELLIGENT MANUFACTURING SOLUTION)
- ELECTROLYTIC CELL POLE FRAME VERTICAL MILLING AUTOMATIC LINE BODY
- ELECTROLYTIC CELL MACHINE FRAME VERTICAL CAR INTELLIGENT LINE BODY
- AUTOMATIC WELDING LINE FOR ELECTROLYTIC CELL PLATES
- ELECTROLYTIC CELL INTELLIGENT EQUIPMENT (STANDARD EQUIPMENT)
- INFORMATION SYSTEM (STANDARD MES)
- HYDROGEN STORAGE BOTTLE SMART FACTORY (SOLUTION)
- FUEL CELL SMART FACTORY (SOLUTION)
- INTRODUCTION TO LITHIUM BATTERIES
- LITHIUM ION CYLINDRICAL BATTERY STANDARD WIRE
- SQUARE SHELL BATTERY MODULE PACK STANDARD LINE (AUTOMATIC)
- STANDARD LINE FOR SQUARE SHELL BATTERY MODULE PACK (SEMI-AUTOMATIC)
- STANDARD WIRE FOR SOFT PACK BATTERY MODULE
- CELL THICKNESS MEASURING MACHINE
- BATTERY CELL ADHESIVE MACHINE
- CELL STACKER/MODULE LOADING EQUIPMENT
- CROSS LINE POLARITY DETECTION&POLE GUIDE ADDRESS
- CROSS LINE LASER WELDING MACHINE
- Customized equipment - photovoltaic
- Automotive Related Equipment
- SMART FACTORY
ASSEMBLE
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AUTOMATIC ASSEMBLY LINE FOR HEADPHONE CHARGERSThe automatic assembly line consists of 14 workstations, with an overall length of ≤ 18m and a width of ≤ 1.2m. It includes lifting and reflux, Button feeding, protective film application, flipping, hot melt adhesive application, magnet installation, pressure holding 1, AB adhesive application, Shield iron sheet application, pressure holding 2, foam application, pressure holding 3, lifting and lowering reflux, and material receiving swing.Detail









