• COMPRESSION MOLDING MACHINE
    The fully automatic molding machine belongs to the semiconductor packaging equipment, which is used in the post packaging film pressing process of chips and can also be used in the chip plastic packaging process. Using release film assisted packaging, the packaging adhesive is flattened and cured on the surface of the substrate or module to form a protective film,
    It provides waterproof, dustproof, and anti-collision protection for chips and other components. Our company has successfully developed various models such as one to one, one to two, and one to four, which can operate independently or be produced online.
    Detail
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We believe that lithium battery, energy storage, solar power and hydrogen energy are all Trillion USD-level markets in the future, which can make your great enterprise. No matter which or several fields you are engaged in, we can provide one-stop technical solution including personnel input from the whole production line process training, to the output of equipment and raw materials, talent training plan and market strategy plan. As long as you have ideas and money, please leave the rest to us.

We are not only a technology industrial company, but also a great consulting company as well as training company. We are also a large supplier of raw materials and equipment in the field of new energy. It can meet your all-round needs in terms of technology, equipment, raw materials, training, strategy, management and market.

If you have money and ideas, please don't miss this Trillion USD-level track that has lasted for decades in the world's four major new energy fields. The sooner you join, the better!

We are waiting for you! Please do not hesitate to contact us.

Contact : David Cao
M/WhatsApp: +86-135 1084 6501
Skype: info_433227
Email: david.cao@bright-ai.com
Address: No. 6 Baoye Road, Shangwei Village, Zhangkengjing Community, Guanhu Street, Longhua District, Shenzhen, China