AUTOMATIC WAFER LAMINATING MACHINE
The wafer automatic film sticking machine is a specialized film sticking process developed by our company for BGA, QFN, FC, FO, Memory and other manufacturing processes. This equipment has the characteristics of uniform film sticking speed, no bubbles, no fragments, no wrinkles, etc. Suitable for all BG films with thicknesses ranging from 100um to 600um, V-notch cutting can be performed according to process requirements, and the height of the worktable and film pressure can be adjusted according to different products. After microscopic comparison and grinding verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment
Product application areas
The wafer automatic film sticking machine is a specialized film sticking process developed by our company for BGA, QFN, FC, FO, Memory and other manufacturing processes. This equipment has the characteristics of uniform film sticking speed, no bubbles, no fragments, no wrinkles, etc. Suitable for all BG films with thicknesses ranging from 100um to 600um, V-notch cutting can be performed according to process requirements, and the height of the worktable and film pressure can be adjusted according to different products. After microscopic comparison and grinding verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment.
Key parameters
Model: BWL-1000
Capacity: UPH ≥ 75PCS/H
Product size: 8-12 hours (customizable)
Dust free grade: Dynamic Class 1000
Yield rate: ≥ 99%
Key parameters
Model: BWL-1000
Capacity: UPH ≥ 75PCS/H
Product size: 8-12 hours (customizable)
Dust free grade: Dynamic Class 1000
Yield rate: ≥ 99%
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AUTOMATIC WAFER LAMINATING MACHINEDetail
