WAFER VACUUM COATING MACHINE
The fully automatic wafer vacuum film sticking machine is applied to the automatic edge cutting and vacuum bonding of protective films for semiconductor silicon wafer etching and other processes. It is the first domestically developed and finalized equipment independently designed and manufactured by our company. After microscopic comparison verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment. By using a quick change stage, it is possible to quickly correspond to wafers of different sizes at 8 o’clock/12 o’clock.
Product application areas
The fully automatic wafer vacuum film sticking machine is applied to the automatic edge cutting and vacuum bonding of protective films for semiconductor silicon wafer etching and other processes. It is the first domestically developed and finalized equipment independently designed and manufactured by our company. After microscopic comparison verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment. By using a quick change stage, it is possible to quickly correspond to wafers of different sizes at 8 o'clock/12 o'clock.
Key parameters
Model: BWL-2000
Capacity: UPH ≥ 20PCS/H
Product size: 8-12 hours (customizable)
Dust free grade: Dynamic Class 1000
Yield rate: ≥ 99%
Equipment size: L2300xW2100xH2200mm
Key parameters
Model: BWL-2000
Capacity: UPH ≥ 20PCS/H
Product size: 8-12 hours (customizable)
Dust free grade: Dynamic Class 1000
Yield rate: ≥ 99%
Equipment size: L2300xW2100xH2200mm
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WAFER VACUUM COATING MACHINEDetail
