AUTOMATIC WAFER TEARING MACHINE
Fully automatic wafer tearing machine applied to BGA, QFN
FC、FO、Memory During the film tearing process, this equipment has the characteristics of uniform film tearing speed, stable film tearing, no fragments, and strong compatibility. Suitable for all thicknesses up to 100um~
600um BG film, UV film, etc. It can be paired with UV glue remover according to process requirements.
FC、FO、Memory During the film tearing process, this equipment has the characteristics of uniform film tearing speed, stable film tearing, no fragments, and strong compatibility. Suitable for all thicknesses up to 100um~
600um BG film, UV film, etc. It can be paired with UV glue remover according to process requirements.
Product application areas
Fully automatic wafer tearing machine applied to BGA, QFN
FC、FO、Memory During the film tearing process, this equipment has the characteristics of uniform film tearing speed, stable film tearing, no fragments, and strong compatibility. Suitable for all thicknesses up to 100um~
600um BG film, UV film, etc. It can be paired with UV glue remover according to process requirements.
key parameter
Model: BTF-3000
Capacity: UPH ≥ 70PCS/H
Product size: 8-12 hours
Dust free grade: Dynamic Class 1000
Yield rate: ≥ 99%
Equipment size: L2000xW2100xH2200mm
FC、FO、Memory During the film tearing process, this equipment has the characteristics of uniform film tearing speed, stable film tearing, no fragments, and strong compatibility. Suitable for all thicknesses up to 100um~
600um BG film, UV film, etc. It can be paired with UV glue remover according to process requirements.
key parameter
Model: BTF-3000
Capacity: UPH ≥ 70PCS/H
Product size: 8-12 hours
Dust free grade: Dynamic Class 1000
Yield rate: ≥ 99%
Equipment size: L2000xW2100xH2200mm
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AUTOMATIC WAFER TEARING MACHINEDetail
