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Product>COMPRESSION MOLDING MACHINE
  • COMPRESSION MOLDING MACHINE
    The fully automatic molding machine belongs to the semiconductor packaging equipment, which is used in the post packaging film pressing process of chips and can also be used in the chip plastic packaging process. Using release film assisted packaging, the packaging adhesive is flattened and cured on the surface of the substrate or module to form a protective film,
    It provides waterproof, dustproof, and anti-collision protection for chips and other components. Our company has successfully developed various models such as one to one, one to two, and one to four, which can operate independently or be produced online.
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