Wafer Packaging & Testing Smart Equipment--Bright Automatrix Inc.

Product>Wafer Packaging & Testing Smart Equipment

AUTOMATIC WAFER TEARING MACHINE

Fully automatic wafer tearing machine applied to BGA, QFN
FC、FO、Memory During the film tearing process, this equipment has the characteristics of uniform film tearing speed, stable film tearing, no fragments, and strong compatibility. Suitable for all thicknesses up to 100um~
600um BG film, UV film, etc. It can be paired with UV glue remover according to process requirements.

Detail
AOI DETECTOR

AOI inspection machine is a visual inspection equipment developed by our company for chips in new cutting processes, used to control quality issues such as cutting size and appearance. We use independently developed visual systems and algorithm software to detect the cutting quality of chips from both sides. It can be operated as a standalone machine or produced online in a production line; Compatible with manual and crane loading and unloading.

Detail
AUTOMATIC WAFER LAMINATING MACHINE

The wafer automatic film sticking machine is a specialized film sticking process developed by our company for BGA, QFN, FC, FO, Memory and other manufacturing processes. This equipment has the characteristics of uniform film sticking speed, no bubbles, no fragments, no wrinkles, etc. Suitable for all BG films with thicknesses ranging from 100um to 600um, V-notch cutting can be performed according to process requirements, and the height of the worktable and film pressure can be adjusted according to different products. After microscopic comparison and grinding verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment

Detail
WAFER VACUUM COATING MACHINE

The fully automatic wafer vacuum film sticking machine is applied to the automatic edge cutting and vacuum bonding of protective films for semiconductor silicon wafer etching and other processes. It is the first domestically developed and finalized equipment independently designed and manufactured by our company. After microscopic comparison verification, its film cutting accuracy, edge contour, sealing quality and other indicators are superior to similar imported equipment. By using a quick change stage, it is possible to quickly correspond to wafers of different sizes at 8 o’clock/12 o’clock.

Detail

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